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Solder application, Recommended through-hole diameter 2.1 phi mm

  • Solder application.
  • Finish....Au plating over Ni
  • Material....Copper
  • Rated Current....30A
  • Recommended Through-hole Diameter (phi mm)....2.1
  
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N/O
L (mm)
(A)
DG-3
3
0.5
DG-4
4
0.5
DG-5
5
0.7
DG-6
6
1.0
DG-7
7
1.0
DG-8
8
1.0
DG-9
9
1.0
DG-10
10
1.0
DG-12.5
12.5
1.0
DG-15
15
1.0
DG-17.5
17.5
1.0
DG-20
20
1.0
DG-25
25
1.0
DG-30
30
1.0
DG-35
35
1.0
DG-40
40
1.0